Depaneling Systems for precise, stress-free board separation
Our depaneling systems use advanced and proven separation techniques Sawing, Routing, and Laser cutting to achieve exceptional precision, with accuracies down to 100μm. Whether you need to separate rigid or flexible PCBs from different materials, our systems meet diverse production requirements. We offer customizable setups for Offline, Island, and Inline configurations, allowing seamless integration into your existing processes. Regardless of the material, size or contour, our systems provide accurate and efficient panel separation.