Assembly processes

Dispensing involves applying adhesives, sealants, or solder paste using precision-controlled dispensers. It ensures accurate material deposition for bonding, conformal coating, and potting applications.

Automated or manual screw driving is used to secure components in place. This process ensures mechanical stability and can also help with electrical grounding in certain applications.

Press-fit technology allows pins to be inserted into plated-through holes without the need for soldering. This technique provides reliable electrical and mechanical connections, commonly used in connectors and backplanes.

Bending is used to shape metal leads or connectors to fit into specific designs. This process is essential for custom component placement and ensuring optimal electrical contact.

Laser welding is a high-precision technique used for joining small electronic components. It provides strong and clean welds, making it ideal for applications like battery connections, sensors, and EMI shielding.

Soldering is essential for creating strong electrical and mechanical joints between components and PCBs. Methods like wave soldering, selective soldering, and reflow soldering are used based on design and application requirements.

CWire bonding connects semiconductor dies to lead frames or PCBs using fine wires. This technique, commonly used in microelectronics, includes ultrasonic, thermosonic, and thermocompression bonding.

Pick & Place machines automate the placement of surface-mount devices (SMDs) onto PCBs. This high-speed process ensures accuracy and consistency in electronic assembly.

Protective coatings like conformal coatings and potting compounds safeguard electronic components from moisture, dust, and corrosion. Encapsulation enhances durability, particularly for harsh environments.

Heat staking is a process that bonds plastic components by applying controlled heat and pressure, creating a strong and permanent connection. This technique is commonly used in applications requiring precise and reliable assembly, such as sensor housings and automotive electronics.

Testing ensures that assembled electronics function correctly and meet design specifications. Methods like in-circuit testing (ICT) and functional circuit testing (FCT) help identify manufacturing defects.

Automated optical inspection (AOI) detects assembly defects such as misaligned components, soldering issues, and hidden voids. This technique improves quality control in mass production.