SMTconnect 2023 - Get your free ticket
For the 7th time in a row, IPTE participates in Fraunhofer's Future Packaging line where we supply as much as two-thirds of all machines. In the line, you will discover the latest generation FlexRouter and FlexMarker II. Joined by numerous other CE-certified machines for PCB handling, processing and testing.
At our booth next to the Future Packaging line, you'll find our game-changing innovations in PCB testing. Capable of testing pads as little as 300µm and achieving pitches down to 400µm with a contacting force up to 3N. Highly efficient thanks to their small footprint, robustness and speed, they outperform current flying probe or rigid probe adapter solutions with ease.
Visit us in hall 5 at booth 434A.
Our team looks forward to your visit!
Highlights at SMTconnect 2023
Precision Contacting Test handler & Fine Pitch SleeveProbe™
Game-changing & patented PCB testing solution
By this technology, IPTE’s capability expands from PCB’s and ceramic boards to high density electronic assemblies. The SleeveProbe™ principle even enables testing of flexible/soft electronics and 3D electronics.
FlexMarker II - Verify@Once
Checks laser markings up to 75% faster
The industry reference has been further improved. Thanks to an optional high-resolution camera, the FlexMarker II is now able to read multiple codes in one large field of view. Resulting in faster cycle times and less wear on the axes.
FlexRouter Gen3
The new benchmark for inline depaneling
From the ground up, the FlexRouter has been completely redesigned. A process in which both hardware and software gained numerous upgrades. The result is a solid base for depaneling that is customisable to fit seamlessly into any manufacturing process.